C. K. · C.-U. Kim · u k · U. Kim
| title | media type | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|---|
| Electromigration in Thin Films and Electronic Devices: Materials and Reliability | Paperback | 978-0-08-101696-1 (0-08-101696-4) | 2016 | |
| Electromigration in Thin Films and Electronic Devices: Materials and Reliability | Hardcover | 978-1-84569-937-6 (1-84569-937-8) | 2011 | |
| Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability | " | 978-1-4614-9265-8 (1-4614-9265-3) | 2014 | Tae-Kyu Lee · Thomas R. Bieler · Hongtao Ma |
Pergamon Press · Springer · Woodhead Publishing Ltd