Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

Fundamentals

by: Tae-Kyu Lee · Thomas R. Bieler · Choong-Un Kim · Hongtao Ma

Hardcover

ISBN: 978-1-4614-9265-8

ISBN-10: 1-4614-9265-3

Springer · 2014