| title | media type | | ISBN-13 | year of publica-
tion | other author(s) |
|---|
| 3D Cinematic Aesthetics and Storytelling | Gebunden | | 978-3-319-72741-7 | 2018 |
| Advances in Computation and Intelligence: 4th International Symposium, ISICA 2009, Huangshi, China, October 23-25, 2009: 4th International Symposium ... Computer Science and General Issues) | Taschenbuch | | 978-3-642-04842-5 | 2010 | Zhihua Cai · Zhenhua Li · Zhuo Kang |
| Advances in Computation and Intelligence: 5th International Symposium, ISICA 2010, Wuhan, China, October 22-24, 2010, Proceedings | " | | 978-3-642-16492-7 | 2010 | Zhihua Cai · Chengyu Hu · Zhuo Kang |
| Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery: Volume 1 | " | | 978-3-030-32455-1 | 2019 | Lipo Wang · Liang Zhao · Zhengtao Yu |
| Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery: Volume 2 | " | | 978-3-030-32590-9 | 2019 | Lipo Wang · Liang Zhao · Zhengtao Yu |
| Ba hua shuo dao zin wo li | Paperback | | 978-957-9279-49-9 | 2000 |
| Computational Intelligence and Intelligent Systems: 4th International Symposium on Intelligence Computation and Applications, ISICA 2009, Huangshi, ... in Computer and Information Science) | Taschenbuch | | 978-3-642-04961-3 | 2010 | Zhihua Cai · Zhenhua Li · Zhuo Kang |
| Computational Intelligence and Intelligent Systems: 6th International Symposium, ISICA 2012, Wuhan, China, October 27-28, 2012. Proceedings ... Computer and Information Science, Band 316) | " | | 978-3-642-34288-2 | 2012 | Zhenhua Li · Xiang Li · Zhihua Cai |
| Computational Intelligence and Intelligent Systems: 7th International Symposium, ISICA 2015, Guangzhou, China, November 21-22, 2015, Revised Selected ... in Computer and Information Science) | Paperback | | 978-981-10-0355-4 | 2016 | Kangshun Li · Jin Li · Aniello Castiglione |
| Computational Intelligence and Intelligent Systems: 9th International Symposium, ISICA 2017, Guangzhou, China, November 18-19, 2017, Revised Selected ... in Computer and Information Science) | " | | 978-981-13-1647-0 | 2018 | Kangshun Li · Wei Li · Zhangxing Chen |
| Computational Intelligence and Intelligent Systems: 9th International Symposium, ISICA 2017, Guangzhou, China, November 18-19, 2017, Revised Selected ... in Computer and Information Science) | " | | 978-981-13-1650-0 | 2018 | Kangshun Li · Wei Li · Zhangxing Chen |
| Computational Intelligence and Intelligent Systems: 10th International Symposium, ISICA 2018, Jiujiang, China, October 13-14, 2018, Revised Selected ... in Computer and Information Science) | " | | 978-981-13-6472-3 | 2019 | Hu Peng · Changshou Deng · Zhijian Wu |
| Evolvable Hardware | Broschiert | | 978-0-387-50501-5 | 2008 | Tetsuya Higuchi · Xin Yao |
| Evolvable Systems: From Biology to Hardware: 4th International Conference, ICES 2001 Tokyo, Japan, October 3-5, 2001 Proceedings | Taschenbuch | | 978-3-540-42671-4 | 2008 | Tetsuya Higuchi · Masaya Iwata · Kiyoshi Tanaka · Moritoshi Yasunaga |
| Melt Electrospinning: A Green Method to Produce Superfine Fibers | Paperback | | 978-0-12-816220-0 | 2019 | Seeram Ramakrishna · Mohamedazeem M. Mohideen · Kaili Li |
| Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing | Hardcover | | 978-0-470-82780-2 | 2011 | Sheng Liu |
| Passive and Active Measurement: 16th International Conference, PAM 2015, New York, NY, USA, March 19-20, 2015, Proceedings | Taschenbuch | | 978-3-319-15508-1 | 2015 | Jelena Mirkovic |
| Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling | Paperback | | 978-1-4899-8797-6 | 2014 |
| Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling | Hardcover | | 978-1-4614-1052-2 | 2012 |
| Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling | Paperback | | 978-1-4614-1054-6 | 2012 |
| Quality of Service in Optical Burst Switched Networks | Hardcover | | 978-0-387-34160-6 | 2006 | Kee Chaing Chua · Mohan Gurusamy · Minh Hoang Phung |
| The Dutch East India Company's Tea Trade with China, 1757-1781 | " | | 978-90-04-15599-2 | 2006 |
| Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications | Paperback | | 978-1-4939-5438-4 | 2016 | Shichun Qu |
| Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications | Hardcover | | 978-1-4939-1555-2 | 2014 | " |
| Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications | Paperback | | 978-1-4939-1557-6 | 2014 | " |