Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

by Shichun Qu

Paperback

details (USA).
(see also: eBook (Kindle))

details (UK).
(see also: eBook (Kindle))

details (Germany).
(see also: Kindle Ausgabe)

details (Canada).
(see also: eBook (Kindle))

ISBN: 978-1-4939-5438-4

ISBN-10: 1-4939-5438-5

Springer · 2016