by: Shichun Qu · Yong Liu
Paperback
details (USA).
(see also: eBook (Kindle))
ISBN: 978-1-4939-1557-6
ISBN-10: 1-4939-1557-6
Springer · 2014
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|
by: Shichun Qu · Yong LiuPaperback details (USA). ISBN: 978-1-4939-1557-6 ISBN-10: 1-4939-1557-6 Springer · 2014 |
| See also: | ||
| 2016 | Paperback | Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications |
| 2014 | Hardcover | Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications |