| title | media type | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|---|
| Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications | Paperback | 978-1-4939-5438-4 (1-4939-5438-5) | 2016 | |
| Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications | Hardcover | 978-1-4939-1555-2 (1-4939-1555-X) | 2014 | Yong Liu |
| Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications | Paperback | 978-1-4939-1557-6 (1-4939-1557-6) | 2014 | " |