Rao R. Tummala

Chapman and Hall · McGraw-Hill

titleISBN-13year of publica-
tion
other author(s)
Fundamentals of Microsystems Packaging978-0-07-120301-22001
Heat Transfer in Electronic Packages978-0-412-15461-41998
Microelectronics Package Wiring and Electrical Design978-0-412-15491-11998
Microelectronics Packaging Fundamentals978-0-412-14901-61998E.J. Rymaszewski · A.G. Klopfenstein
Microelectronics Packaging Handbook978-0-412-08561-11998Eugene J. Rymaszewski · Alan G. Klopfenstein
Microelectronics Packaging Handbook: Part 3978-0-412-08461-42000E.J. Rymaszewski · A.G. Klopfenstein
Microelectronics Packaging Handbook: Semiconductor Packaging: Technology Drivers Pt. 1978-0-412-08441-61997Tummala · R. R. Tummala
Microelectronics Packaging Handbook: Subsystem Packaging Part III: Technology Drivers Pt. 1978-0-412-08451-51997Tummala · R. R. Tummala
Microelectronics Packaging Handbook: Technology Drivers Pt. 1978-0-412-08431-71997E.J. Rymaszewski · Alan G. Klopfenstein
Plastic, Thin-Film, and Ceramic Packaging978-0-412-15451-51998
Wirebonding in Microelectronics Packaging978-0-412-15481-21998

R.R. · R.R. Tummala · R. T. · R. Tummala · Rao R · Rao Tummala

 

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