Rao R. Tummala

title	ISBN-13	year of publica- tion	other author(s)
Fundamentals of Microsystems Packaging	978-0-07-120301-2	2001
Heat Transfer in Electronic Packages	978-0-412-15461-4	1998
Microelectronics Package Wiring and Electrical Design	978-0-412-15491-1	1998
Microelectronics Packaging Fundamentals	978-0-412-14901-6	1998	E.J. Rymaszewski · A.G. Klopfenstein
Microelectronics Packaging Handbook	978-0-412-08561-1	1998	Eugene J. Rymaszewski · Alan G. Klopfenstein
Microelectronics Packaging Handbook: Part 3	978-0-412-08461-4	2000	E.J. Rymaszewski · A.G. Klopfenstein
Microelectronics Packaging Handbook: Semiconductor Packaging: Technology Drivers Pt. 1	978-0-412-08441-6	1997	Tummala · R. R. Tummala
Microelectronics Packaging Handbook: Subsystem Packaging Part III: Technology Drivers Pt. 1	978-0-412-08451-5	1997	Tummala · R. R. Tummala
Microelectronics Packaging Handbook: Technology Drivers Pt. 1	978-0-412-08431-7	1997	E.J. Rymaszewski · Alan G. Klopfenstein
Plastic, Thin-Film, and Ceramic Packaging	978-0-412-15451-5	1998
Wirebonding in Microelectronics Packaging	978-0-412-15481-2	1998