Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging: Part 3

by: R.R. Tummala · Eugene J. Rymaszewski · Alan G. Klopfenstein

Paperback

details (UK).

ISBN: 978-0-412-08461-4

ISBN-10: 0-412-08461-9

Springer · 1997