Rao Tummala

R. T. · R. Tummala · Rao R. Tummala

titleISBN-13year of publica-
tion
other author(s)
Electronic Packaging for High Reliability, Low Cost Electronics978-0-7923-5218-12000Marija Kosec · W.K. Jones · Darko Belavic
Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition978-1-259-86155-02019
Fundamentals of Microsystems Packaging978-0-07-137169-82001
Introduction to Microelectronics Packaging978-0-07-137167-42000
Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging: Part 3978-0-412-08461-41997Eugene J. Rymaszewski · Alan G. Klopfenstein
Microelectronics Packaging Handbook on CD-ROM978-0-412-08561-11998Eugene J. Rymaszewski · Alan G. Klopfenstein
Microelectronics Packaging Handbook: Technology Drivers Part I: Technology Drivers Pt. 1978-0-412-08431-71997Eugene J. Rymaszewski · Alan G. Klopfenstein
Second Level Microelect Packaging978-0-412-15471-32001Eugene J. Rymaszewski · Alan G. Klopfenstein
System on Package: Miniaturization of the Entire System978-0-07-145906-82008

Chapman and Hall · McGraw-Hill · McGraw-Hill Education · Springer

 

Raoul Tignères