John W. Balde

titlemedia typeISBN-13
(ISBN-10)
year of publication
Foldable Flex and Thinned Silicon Multichip Packaging TechnologyPaperback978-1-4613-4977-8
(1-4613-4977-X)
2014
Foldable Flex and Thinned Silicon Multichip Packaging TechnologyHardcover978-0-7923-7676-7
(0-7923-7676-5)
2003

J.B. · J. W. · John B. · John W. · W. B

John W. Baldwin