by John W. Balde
Paperback
ISBN: 978-1-4613-4977-8
ISBN-10: 1-4613-4977-X
Springer · 2014
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by John W. BaldePaperback
ISBN: 978-1-4613-4977-8 ISBN-10: 1-4613-4977-X Springer · 2014 |
| See also: | ||
| 2003 | Hardcover | Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging) |