Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging)
by
John W. Balde
Hardcover
details (
USA
).
ISBN: 978-0-7923-7676-7
ISBN-10: 0-7923-7676-5
Springer
· 2003
See also:
2014
Paperback
Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging)