Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging)

Packaging

by John W. Balde

Hardcover

ISBN: 978-0-7923-7676-7

ISBN-10: 0-7923-7676-5

Springer · 2003

See also:
2014PaperbackFoldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging)