| title | media type | ISBN-13 | year of publica-
tion | other author(s) |
|---|
| 3D IC Integration and Packaging | Hardcover | 978-0-07-184806-0 | 2015 |
| Advanced MEMS Packaging | " | 978-0-07-162623-1 | 2009 | Cheng Kuo Lee · C. S. Premachandran · Yu Aibin |
| Assembly and Reliability of Lead-Free Solder Joints | " | 978-981-15-3919-0 | 2020 | Ning-Cheng LEE |
| Ball Grid Array Technology | " | 978-0-07-036608-4 | 1994 |
| Chip Scale Package: Design, Materials, Process, Reliability, and Applications | " | 978-0-07-038304-3 | 1999 | Ricky S.W. Lee · S.W. Ricky Lee |
| Electronic Packaging: Design, Materials, Process, and Reliability | " | 978-0-07-037135-4 | 1998 | C.P. Wong · J.L. Prince |
| Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials | " | 978-0-07-138624-1 | 2002 | C.P. Wong · Ning-Cheng Lee · Ricky S.W. Lee |
| Fan-Out Wafer-Level Packaging | " | 978-981-10-8883-4 | 2018 |
| Fan-Out Wafer-Level Packaging | Paperback | 978-981-13-4266-0 | 2018 |
| Flip Chip Technologies | Hardcover | 978-0-07-036609-1 | 1995 |
| Handbook Of Tape Automated Bonding | Paperback | 978-1-4614-9868-1 | 2014 |
| Heterogeneous Integrations | " | 978-981-13-7226-1 | 2020 |
| Heterogeneous Integrations | Hardcover | 978-981-13-7223-0 | 2019 |
| Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies | " | 978-0-07-135141-6 | 2000 |
| Microvias: For Low Cost, High Density Interconnects | " | 978-0-07-136327-3 | 2001 | S.W. Ricky Lee |
| Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies | " | 978-0-07-036648-0 | 1996 | Yi-Hsin Pao |
| Through-Silicon Vias for 3D Integration | " | 978-0-07-178514-3 | 2012 |