by John H. Lau
Hardcover
details (USA).
(see also: eBook (Kindle))
details (UK).
(see also: eBook (Kindle))
details (Germany).
(see also: Kindle Ausgabe)
ISBN: 978-981-10-8883-4
ISBN-10: 981-10-8883-7
Springer · 2018
|
|
by John H. LauHardcover details (USA). details (UK). details (Germany). ISBN: 978-981-10-8883-4 ISBN-10: 981-10-8883-7 Springer · 2018 |
| See also: | ||
| 2018 | Paperback | Fan-Out Wafer-Level Packaging |