AVA Publishing SA · McGraw-Hill
| title | ISBN-13 | year of publica- tion | other author(s) |
|---|---|---|---|
| 3D IC Integration and Packaging | 978-0-07-184806-0 | 2015 | |
| Advanced Copper-Gold Wire-Stud Interconnection Technologies | 978-0-07-178516-7 | 2012 | Hong Meng Ho |
| Advanced MEMS Packaging | 978-0-07-162623-1 | 2009 | Cheng Lee · C. Premachandran · Yu Aibin |
| Basics fashion design 07 designing accessories /anglais | 978-2-940411-31-3 | 2012 | |
| Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials | 978-0-07-138624-1 | 2002 | C.P. Wong · Ning-Cheng Lee · Ricky Lee |
| Reliability of RoHS-Compliant 2D and 3D IC Interconnects | 978-0-07-175379-1 | 2010 | |
| Through-Silicon Vias for 3D Integration | 978-0-07-178514-3 | 2012 | |
Dr John H. Lau · J. L. · J. Lau · John H. Lau · John L. · John Laue