John Lau

AVA Publishing SA · McGraw-Hill

titleISBN-13year of publica-
other author(s)
3D IC Integration and Packaging978-0-07-184806-02015
Advanced Copper-Gold Wire-Stud Interconnection Technologies978-0-07-178516-72012Hong Meng Ho
Advanced MEMS Packaging978-0-07-162623-12009Cheng Lee · C. Premachandran · Yu Aibin
Basics fashion design 07 designing accessories /anglais978-2-940411-31-32012
Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials978-0-07-138624-12002C.P. Wong · Ning-Cheng Lee · Ricky Lee
Reliability of RoHS-Compliant 2D and 3D IC Interconnects978-0-07-175379-12010
Through-Silicon Vias for 3D Integration978-0-07-178514-32012

Dr John H. Lau · J. L. · J. Lau · John H. Lau · John L. · John Laue


John Lauber