C.P. Wong

titlemedia type ISBN-13year of publica-
tion
other author(s)
Advanced Electronic Packaging: Volume 968Hardcover 978-1-55899-925-12007V. P. Atluri · D. Frear · S. Sharan
Advanced Flip Chip Packaging   " 978-1-4419-5767-22013Ho-Ming Tong · Yi-Shao Lai
Electrical Conductive Adhesives with Nanotechnologies   " 978-0-387-88782-12009Yi (Grace) Li · Daniel Lu
Electronic Packaging: Design, Materials, Process, and Reliability   " 978-0-07-037135-41998John H. Lau · J.L. Prince
Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials   " 978-0-07-138624-12002John Lau · Ning-Cheng Lee · Ricky Lee
Materials for Advanced PackagingTaschenbuch
978-3-319-83209-82018Daniel Lu
Materials for Advanced PackagingGebunden
978-3-319-45097-12016   "
Materials for Advanced PackagingHardcover 978-0-387-78218-82008   "
Materials, Technology and Reliability for Advanced Interconnects 2005: Volume 863Paperback 978-1-107-40898-22014Paul R. Besser · Andrew J. McKerrow · Francsca Iacopi · Joost J. Vlassak
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging   " 978-1-4899-7885-12016Ephraim Suhir · Y.C. Lee
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and PackagingHardcover 978-0-387-27974-92007Ephraim Suhir · Y.C. Lee
Nano-Bio- Electronic, Photonic and MEMS Packaging   " 978-1-4419-0039-52010Kyoung-Sik Moon · Yi (Grace) Li
Polymers for Electronic & Photonic Application   " 978-0-12-762540-91992

C.P. · C. W. · C Wong · Cathy S.P. Wong · Ching-Ping Wong · Ching-Pong Wong · Christelle Pédémas-Wong · Christine P. W. Wong · P W. · P. Wong

Academic Press · Cambridge University Press · McGraw-Hill · Springer

 

C.P. Woodbury