Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging
by:
Ephraim Suhir
·
Y.C. Lee
·
C.P. Wong
Hardcover
details (
USA
).
ISBN: 978-0-387-27974-9
ISBN-10: 0-387-27974-1
Springer
· 2007
See also:
2016
Paperback
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging