| title | media type | | ISBN-13 | year of publica-
tion | other author(s) |
|---|
| Advanced Electronic Packaging: Volume 968 | Hardcover | | 978-1-55899-925-1 | 2007 | V. P. Atluri · D. Frear · S. Sharan |
| Advanced Flip Chip Packaging | " | | 978-1-4419-5767-2 | 2013 | Ho-Ming Tong · Yi-Shao Lai |
| Electrical Conductive Adhesives with Nanotechnologies | " | | 978-0-387-88782-1 | 2009 | Yi (Grace) Li · Daniel Lu |
| Electronic Packaging: Design, Materials, Process, and Reliability | " | | 978-0-07-037135-4 | 1998 | John H. Lau · J.L. Prince |
| Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials | " | | 978-0-07-138624-1 | 2002 | John Lau · Ning-Cheng Lee · Ricky Lee |
| Materials for Advanced Packaging | Taschenbuch | | 978-3-319-83209-8 | 2018 | Daniel Lu |
| Materials for Advanced Packaging | Gebunden | | 978-3-319-45097-1 | 2016 | " |
| Materials for Advanced Packaging | Hardcover | | 978-0-387-78218-8 | 2008 | " |
| Materials, Technology and Reliability for Advanced Interconnects 2005: Volume 863 | Paperback | | 978-1-107-40898-2 | 2014 | Paul R. Besser · Andrew J. McKerrow · Francsca Iacopi · Joost J. Vlassak |
| Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging | " | | 978-1-4899-7885-1 | 2016 | Ephraim Suhir · Y.C. Lee |
| Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging | Hardcover | | 978-0-387-27974-9 | 2007 | Ephraim Suhir · Y.C. Lee |
| Nano-Bio- Electronic, Photonic and MEMS Packaging | " | | 978-1-4419-0039-5 | 2010 | Kyoung-Sik Moon · Yi (Grace) Li |
| Polymers for Electronic & Photonic Application | " | | 978-0-12-762540-9 | 1992 |