| title | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|
| Advances in Electronic Packaging 1992: Proceedings of the 1992 Joint Asme/Jsme Conference on Electronic Packaging | 978-0-7918-0766-8 (0-7918-0766-5) | 1992 | |
| Application of Fracture Mechanics in Electronic Packaging: Presented at the 1997 Asme International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas | 978-0-7918-1827-5 (0-7918-1827-6) | 1997 | D. T. Read · American Society of Mechanical Engineers. Applied Mechanics Division |
| Manufacturing Process and Materials Challenges in Microelectronic Packaging: Presented at the Winter Annual Meeting of the American Society of ... December 1-6, 1991 | 978-0-7918-0896-2 (0-7918-0896-3) | 1991 | Peter A. Engel · W. E. Jahsman |
T. C. · T. Chen · W.C. · W. Chen · W. T. · W.T. Chen · William C. · William Chen · William T