Application of Fracture Mechanics in Electronic Packaging: Presented at the 1997 Asme International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas (Amd Series)

by: American Society of Mechanical Engineers. Applied Mechanics Division · American Society of Mechanical Engineers. Electrical and Electronic Packaging Division · Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta · Symposium on Application of Fracture Mechanics in Electronic packaging

Hardcover

ISBN: 978-0-7918-1827-5

ISBN-10: 0-7918-1827-6

Amer Society of Mechanical · 1997