Tien Y. Wu

titleISBN-13
(ISBN-10)
year of publica-
tion
other author(s)
Application of Fracture Mechanics in Electronic Packaging and Materials: Presented at the 1995 Asme International Mechanical Engineering Congress and ... Francisco, California978-O-7918-1736-O
(O-7918-1736-9)
1995Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta · American Society of Mechanical Engineers. Electrical and Electronic Packaging Division · American Society of Mechanical Engineers Materials Division

T W · T. Wu · Y. Wu

Tien-Yau Luh