Application of Fracture Mechanics in Electronic Packaging and Materials: Presented at the 1995 Asme International Mechanical Engineering Congress and ... Francisco, California (Eep (Series), V. 11.)

by: Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta · Tien Y. Wu · American Society of Mechanical Engineers. Electrical and Electronic Packaging Division · American Society of Mechanical Engineers Materials Division

Paperback

ISBN: 978-0-7918-1736-0

ISBN-10: 0-7918-1736-9

Amer Society of Mechanical · 1995