Symposium on Application of Fracture Mechanics in Electronic packaging

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(ISBN-10)
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Application of Fracture Mechanics in Electronic Packaging: Presented at the 1997 Asme International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas978-O-7918-1827-5
(O-7918-1827-6)
1997American Society of Mechanical Engineers. Applied Mechanics Division · American Society of Mechanical Engineers. Electrical and Electronic Packaging Division · Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta

A. o · o.A. · s. a. · S.O.

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