| title | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) | |
|---|---|---|---|---|
| Handbook of 3D Integration: Vol. 4: Design, Test, and Thermal Management | 978-3-527-33855-9 (3-527-33855-1) | 2019 | Paul D. Franzon · Erik Jan Marinissen · Philip Garrou · Mitsumasa Koyanagi · Peter Ramm | |
| Integrated Interconnect Technologies for 3D Nanoelectronic Systems | 978-1-59693-246-3 (1-59693-246-5) | 2008 | Professor James D Meindl |