Michael Pecht

M.P. · Michael G. Pecht · Michael P.

titlemedia typeISBN-13year of publica-
tion
other author(s)
China's Electronics Industry: The Definitive Guide for Companies and Policy Makers with Interest in ChinaPaperback978-0-8155-1536-42007
Copper Wire BondingHardcover978-1-4614-5760-22013Preeti Chauhan · Anupam Choubey · ZhaoWei Zhong
Electronic Packaging Reliability: 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993Paperback978-0-7918-1035-41993Luu T. Nguyen
Encapsulation Technologies for Electronic Applications   "978-0-12-811978-52018Haleh Ardebili · Jiawei Zhang
Encapsulation Technologies for Electronic ApplicationsHardcover978-0-8155-1576-02009Haleh Ardebili
Guidebook for Managing Silicon Chip ReliabilityPaperback978-0-367-40006-42019Riko Radojcic · Gopal Rao
Handbook of Electronic Package DesignHardcover978-0-8247-7921-41991
Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach   "978-0-8493-9450-81997Pradeep Lall · Edward B. Hakim
Placement and Routing of Electronic ModulesPaperback978-0-367-40242-62019
Placement and Routing of Electronic ModulesHardcover978-0-8247-8916-91993
Product Reliability, Maintainability, and Supportability Handbook   "978-0-8493-9879-72009
Product Reliability, Maintainability, and Supportability Handbook   "978-0-8493-9457-71995The Arinc Inc
Reliability Engineering   "978-1-118-14067-32014Kailash C. Kapur
Reliability of Power Electronic Converter Systems   "978-1-84919-901-82015Frede Blaabjerg · Henry Shu-Hung Chung · Huaiqing Wang
The Chinese Electronics Industry   "978-1-138-43464-62017
The Japanese Electronics IndustryPaperback978-1-58488-026-41999Wataru Nakayama · WIlliam Boulton

ASME Press (American Society of Mechanical Engineers) · Academic Press · CRC Press · Chapman and Hall/CRC · Institution of Engineering and Technology · Routledge · Springer · Wiley · William Andrew

 

Michael Peck