Cambridge University Press · Wiley
| title | media type | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|---|
| Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC | Hardcover | 978-0-470-62346-6 (0-470-62346-2) | 2012 | |
| Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC | Printed Access Code | 978-1-118-16672-7 (1-118-16672-8) | 2012 | |
| Plasmonic Nanoelectronics and Sensing | Hardcover | 978-1-107-02702-2 (1-107-02702-0) | 2014 | Hong-Son Chu |