Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

by Er-Ping Li Hardcover details (USA). (see also: eBook (Kindle)) details (United Kingdom). (see also: eBook (Kindle)) details (Germany). (see also: Kindle Ausgabe) details (Canada). (see also: eBook (Kindle)) ISBN: 978-0-470-62346-6 ISBN-10: 0-470-62346-2 Wiley-IEEE Press · 2012