CRC Press · Woodhead Publishing Ltd
| title | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|
| Failure of Electronic Packaging: Effects of Tempature, Moisture, and Mechanical Driving Forces | 978-1-4398-2788-8 (1-4398-2788-5) | 2010 | S. K. Woon · Y. W. Mai |
| Failure of Electronic Packaging: Effects of Temperature, Moisture, Mechanical, and Electrical Driving Forces | 978-1-4398-0209-0 (1-4398-0209-2) | 2010 | Y. W. Mai |
| Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and ... ... Series in Electronic and Optical Materials) | 978-1-84569-528-6 (1-84569-528-3) | 2015 | Y.-W. Mai |
E.H. · E. Wong · Elizabeth H. Wong · H.W. · H. Wong