Failure of Electronic Packaging: Effects of Temperature, Moisture, Mechanical, and Electrical Driving Forces

by: E. H. Wong · Y. W. Mai

Hardcover

ISBN: 978-1-4398-0209-0

ISBN-10: 1-4398-0209-2

CRC Press · 2010

See also (possibly by other authors):
2015HardcoverRobust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and ... ... Series in Electronic and Optical Materials)