| title | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|
| Application of Fracture Mechanics in Electronic Packaging: Presented at the 1997 Asme International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas | 978-O-7918-1827-5 (O-7918-1827-6) | 1997 | William T. Chen · American Society of Mechanical Engineers. Applied Mechanics Division |
(D-R) · D. Read · D. T. · Dr. Trina E. Read · T. R.