| title | ISBN-13 | year of publica- tion | other author(s) |
|---|---|---|---|
| Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging: Part 3 | 978-0-412-08461-4 | 1997 | R.R. Tummala · Eugene J. Rymaszewski |
| Microelectronics Packaging Handbook on CD-ROM | 978-0-412-08561-1 | 1998 | R.R. Tummala · Eugene J. Rymaszewski |
| Microelectronics Packaging Handbook: Semiconductor Packaging: Technology Drivers Pt. 1 | 978-0-412-08441-6 | 1997 | R.R. Tummala · Eugene J. Rymaszewski |
| Microelectronics Packaging Handbook: Subsystem Packaging Part III: Technology Drivers Pt. 1 | 978-0-412-08451-5 | 1997 | R.R. Tummala · Eugene J. Rymaszewski |
| Microelectronics Packaging Handbook: Technology Drivers Part I: Technology Drivers Pt. 1 | 978-0-412-08431-7 | 1997 | Rao Tummala · Eugene J. Rymaszewski |
| Second Level Microelect Packaging | 978-0-412-15471-3 | 2001 | Rao Tummala · Eugene J. Rymaszewski |
A.G. · A.G. Klopfenstein · A. K. · Alan G. · G. K.