A.G. · A. K. · Alan G. Klopfenstein · G. K.
| title | ISBN-13 | year of publica- tion | other author(s) |
|---|---|---|---|
| Microelectronics Packaging Fundamentals | 978-0-412-14901-6 | 1998 | Rao R. Tummala · E.J. Rymaszewski |
| Microelectronics Packaging Handbook: Part 3 | 978-0-412-08461-4 | 2000 | Rao R. Tummala · E.J. Rymaszewski |
| Microelectronics Packaging Handbook: Subsystem Packaging v. 3 | 978-0-412-08451-5 | 1997 | Rao R. Tummala · E.J. Rymaszewski |
| Microelectronics Packaging Handbook: Technology Drivers v. 1 | 978-0-412-08431-7 | 1997 | R. Tummala · E.J. Rymaszewski · E.J. Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, New York, USA) Rymaszewski |