by Y C Lee
Hardcover
details (USA).
(see also: eBook (Kindle))
details (UK).
(see also: eBook (Kindle))
details (Germany).
(see also: Kindle Ausgabe)
ISBN: 978-981-322-935-8
ISBN-10: 981-322-935-7
World Scientific Publishing Co Pte Ltd · 2018
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by Y C LeeHardcover details (USA). details (UK). details (Germany). ISBN: 978-981-322-935-8 ISBN-10: 981-322-935-7 World Scientific Publishing Co Pte Ltd · 2018 |
| See also (possibly by other authors): | ||
| 2003 | Hardcover | MEMS Packaging (Materials, Circuits and Devices) |