MEMS Packaging (Materials, Circuits and Devices)

Packaging

by Tai-Ran Hsu

Hardcover

details (UK).
(see also: eBook (Kindle))

details (USA).
(see also: eBook (Kindle))

details (Germany).
(see also: Kindle Ausgabe)

details (Canada).
(see also: eBook (Kindle))

ISBN: 978-0-86341-335-3

ISBN-10: 0-86341-335-8

Institution of Engineering and Technology · 2003

See also (possibly by other authors):
2018	Hardcover	MEMS Packaging (Wspc Advanced Integration and Packaging)