by Jie Cheng
Paperback
details (United States).
(see also: eBook (Kindle))
details (UK).
(see also: eBook (Kindle))
details (Germany).
(see also: Kindle Ausgabe)
ISBN: 978-981-13-5585-1
ISBN-10: 981-13-5585-1
Springer · 2019
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by Jie ChengPaperback details (United States). details (UK). details (Germany). ISBN: 978-981-13-5585-1 ISBN-10: 981-13-5585-1 Springer · 2019 |
| See also: | ||
| 2017 | Hardcover | Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (Springer Theses) |