Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (Springer Theses)

by Jie Cheng Hardcover details (USA). (see also: eBook (Kindle)) details (United Kingdom). (see also: eBook (Kindle)) details (Germany). (see also: Kindle Ausgabe) details (Spain - España). (see also: Versión Kindle) ISBN: 978-981-10-6164-6 ISBN-10: 981-10-6164-5 Springer · 2017