Xing-Chang Wei

C. W. · C. Wei · Xing Wei

titlemedia typeISBN-13year of publication
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and PackagingHardcover978-1-138-03356-62017
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and PackagingDigital978-1-315-30584-42017
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging   "978-1-315-30585-12017
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging   "978-1-315-30586-82017
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging   "978-1-315-30587-52017

Xing Chao (Chuck) Yuan