| title | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|
| Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore | 978-O-O8-1O2532-1 (O-O8-1O2532-7) | 2019 | Hengyun Zhang · Faxing Che · Tingyu Lin |
Wangmeng Zuo · Wansen Zhu · Wengang Zhou · Wenjing Zuo · Wenjun Zhi · Wenquan Zhou · Wenshan Zhou · Wensheng Zhou