| title | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|
| Manufacturing Process and Materials Challenges in Microelectronic Packaging: Presented at the Winter Annual Meeting of the American Society of ... December 1-6, 1991 | 978-O-7918-O896-2 (O-7918-O896-3) | 1991 | William T. Chen · Peter A. Engel |