Shakya Shilak

S S · Saskia Scholz

TitelISBN-13
(ISBN-10)
Erscheinungsjahr
Stress Analysis of Bonded Assemblies: Applications inMicroelectronics: Axisymmetric Assemblies under Thermal Loading978-3-639-O6O32-4
(3-639-O6O32-6)
2008

Shalendra Sharma