| title | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|
| Chip Scale Package: Design, Materials, Process, Reliability, and Applications | 978-0-07-038304-3 (0-07-038304-9) | 1999 | John H. Lau · Ricky S.W. Lee |
| Microvias: For Low Cost, High Density Interconnects | 978-0-07-136327-3 (0-07-136327-0) | 2001 | John H. Lau |
R. L · R. Lee · Ricky Lee · S. L. · S. Lee · S R · S.R. Lee · S W · S. W. Lee · W.L. · W. Lee · W R · W. R. Lee