CRC Press · Woodhead Publishing Ltd
| title | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|
| Failure of Electronic Packaging: Effects of Tempature, Moisture, and Mechanical Driving Forces | 978-1-4398-2788-8 (1-4398-2788-5) | 2010 | E. H. Wong · Y. W. Mai |
| Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and ... ... Series in Electronic and Optical Materials) | 978-1-84569-528-6 (1-84569-528-3) | 2015 | E. H. Wong · Y. W. Mai |