| Titel | Art | ISBN-13 | Erschei- nungsjahr | andere Autoren | |
|---|---|---|---|---|---|
| Guidebook for Managing Silicon Chip Reliability | Paperback | 978-0-367-40006-4 | 2019 | Michael Pecht · Gopal Rao | |
| Managing More-than-Moore Integration Technology Development: A Story of an Advanced Technology Program in the Semiconductor Industry | Taschenbuch | 978-3-030-06495-2 | 2019 | ||
| Managing More-than-Moore Integration Technology Development: A Story of an Advanced Technology Program in the Semiconductor Industry | Gebunden | 978-3-319-92700-8 | 2018 | ||
| More-than-Moore 2.5D and 3D SiP Integration | Taschenbuch | 978-3-319-84932-4 | 2018 | ||
| More-than-Moore 2.5D and 3D SiP Integration | Gebunden | 978-3-319-52547-1 | 2017 | ||
| Three Dimensional System Integration: IC Stacking Process and Design | Hardcover | 978-1-4419-0961-9 | 2010 | Antonis Papanikolaou · Dimitrios Soudris | |