| title | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|
| Chip Scale Package: Design, Materials, Process, Reliability, and Applications | 978-0-07-038304-3 (0-07-038304-9) | 1999 | John H. Lau · S.W. Ricky Lee |
| Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials | 978-0-07-138624-1 (0-07-138624-6) | 2002 | John H. Lau · C.P. Wong · Ning-Cheng Lee |
R. L · R. Lee · R. S. · R. S. Lee · R.W. Lee · Ricky Lee · Ricky S. Lee · Ricky W. · S. L. · S. Lee · S W · S. W. Lee · W.L. · W. Lee