| title | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|
| Chip Scale Package: Design, Materials, Process, Reliability, and Applications | 978-O-O7-O383O4-3 (O-O7-O383O4-9) | 1999 | John H. Lau · Ricky S.W. Lee |
R. L · R. Lee · R. S. · R. S. Lee · Ricky Lee · Ricky S.W. Lee · S. L. · S. Lee