| Titel | Art | ISBN-13 (ISBN-10) | Erscheinungsjahr |
|---|---|---|---|
| Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces | Taschenbuch | 978-3-662-51725-3 (3-662-51725-6) | 2016 |
| Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces | Gebunden | 978-3-662-48821-8 (3-662-48821-3) | 2015 |
Qiang Zhang · Qing Zhang · Qingcai Zhang · Qingyu Zhang · Quing Zhang