| title | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) | |
|---|---|---|---|---|
| Handbook of 3D Integration, Voume 4: Design, Test, and Thermal Management | 978-3-527-33855-9 (3-527-33855-1) | 2017 | Mitsumasa Koyanagi · Peter Ramm · Paul D. Franzon · Muhannad S. Bakir · Eric J. Marinissen | |
| Multichip Module Technology Handbook | 978-0-07-022894-8 (0-07-022894-9) | 1997 | Iwona Turlik · IMAPS (ISHM) |
E. G. ?? · P.E. · P.G. · Philip E. · Philip Garrou