Paul S. Ho

titlemedia type ISBN-13year of publica-
tion
other author(s)
Advanced Interconnects for ULSI TechnologyHardcover 978-0-470-66254-02012Mikhail Baklanov · Ehrenfried Zschech
Advanced Interconnects for Ulsi TechnologyGedruckter Zugangscode 978-1-119-96367-72012Mikhail Baklanov · Ehrenfried Zschech
Low Dielectric Constant Materials for IC ApplicationsTaschenbuch
978-3-642-63221-12012Jihperng Leu · Wei William Lee
Low Dielectric Constant Materials for IC ApplicationsGebunden
978-3-540-67819-92002Jihperng Leu · Wei William Lee
Materials Reliability in Microelectronics III: Volume 309Paperback 978-1-107-40948-42014Kenneth P. Rodbell · William F. Filter · Harold J. Frost
Materials Reliability Issues in Microelectronics: Volume 225   " 978-1-107-40987-32014James R. Lloyd · Frederick G. Yost
Stress Induced Phenomena in Metallization: Fourth International Workshop, Tokyo, Japan, June, 1997Hardcover 978-1-56396-682-81998H. Okabayashi · S. Shingubara
Stress-Induced Phenomena in Metallization: Ninth International Workshop on Stress-Induced Phenomena in Metallization   " 978-0-7354-0459-52007Shinichi Ogawa · Ehrenfried Zschech
Stress-Induced Phenomena in Metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization   " 978-0-7354-0680-32009Ehrenfried Zschech · Shinichi Ogawa

P. H. · P S · P. S. Ho · Paul S. · S H

American Institute of Physics · Cambridge University Press · Springer · Wiley

 

Paul S. Holbo