| title | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|
| Assembly and Reliability of Lead-Free Solder Joints | 978-981-15-3919-0 (981-15-3919-7) | 2020 | John H Lau |
| Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials | 978-0-07-138624-1 (0-07-138624-6) | 2002 | John Lau · C.P. Wong · Ricky Lee |
| Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies | 978-0-7506-7218-4 (0-7506-7218-8) | 2001 | |
C L · C. Lee · Cheng Lee · n/c · N. C. Lee · N. Lee · Ning Cheng · Ning-Cheng Lee PhD
Butterworth-Heinemann · McGraw-Hill · Springer