Wiley-VCH · シーエムシー出版 (shiーemushiーshuppan)
| Titel | ISBN-13 (ISBN-10) | Erschei- nungsjahr | andere Autoren |
|---|---|---|---|
| Handbook of 3D Integration: Vol. 4: Design, Test, and Thermal Management | 978-3-527-33855-9 (3-527-33855-1) | 2019 | Paul D. Franzon · Erik Jan Marinissen · Muhannad S. Bakir · Philip Garrou · Peter Ramm |
| Handbook of 3D Integration: Volume 3: 3D Process Technology | 978-3-527-33466-7 (3-527-33466-1) | 2014 | Philip Garrou · Peter Ramm |
| State-of-the-art next-generation semiconductor memory ISBN: 4882319926 | 978-4-88231-992-4 (4-88231-992-6) | ||